Ushio America Large Field Stepper UX-5 & UX-7 Series
Ushio provides specialized steppers for cutting-edge packaging applications employed in servers and PCs, and in portable devices such as smart phones and tablet PCs. The stepper is intended for package substrates using a stage corresponding to the panel size and UshioÕs proprietary large-area projection lens technology cultivated from many years of expertise in light source and optical technology. High productivity is achieved while realizing the high resolution and overlay accuracy required for the latest packaging substrates.
Ð Includes the worldÕs best-selling super high-pressure UV lamp
Ð UshioÕs irradiation optical system boasts a high degree of uniformity
Ð Unrivaled large-area projector lens
Features & Benefits
- Proprietary TTL non-exposure wavelength alignment system
When observing mask marks using UshioÕs patented ÒTTL non-exposure wavelength alignmentÓ technology, exposure up to the alignment marks of the substrate is unnecessary. In addition, since work marks can be directly observed, there is no reduction in contrast due to masks, enabling accurate alignment using clear marks. - Suits a variety of alignment marks
ÒPattern matching supportÓ for registered patterns does not require particular alignment marks, alignment can be achieved through a variety of wiring patterns. - High resolution
High resolution is obtained by using UshioÕs projection lens for the ÒUPL seriesÓ. Line-space = 5_m design rule full-scale mass production support. - Long depth of field
Due to the long depth of field (±50 to ±100), even if differences in levels, warpage or unevenness in the board cause focal deviation, the pattern profile equivalent to the profile in focus is obtained. This feature is particularly effective when exposure is performed for a thick, dry film or solder resist. - High-speed step-and-repeat by surface stages
Precision air bearings are used to reduce friction, and a plane motor configuration is used to reduce the weight of all moving parts and increase their rigidity. As a result, it is possible to perform high-speed step-and-repeat operations. In addition, the surface stage exerts feedback control using a laser interferometer. Consequently, high-speed operations, as well as superior positioning accuracy, can be achieved. - Elimination of mask damage
Since this is a non-contact projection exposure system, the mask and workpiece do not come into direct contact. Accordingly, the attached resist does not damage the mask. This not only prevents wiring pattern defects but also makes it possible to use the mask semipermanently, reducing running costs. Moreover, since the mask requires no cleaning, we expect improved equipment utilization compared to close contact exposure systems. - High overlay accuracy maintained despite board expansion and contraction
The Òauto scale functionÓ corrects the projection magnification by automatically changing the magnification up to 0.1% according to the expansion or contraction, greatly reducing the deviation in alignment.
- FC-BGA
- FC-CSP
- Interposer
- 2.1D
- 2.5D
- Packaging
- Semiconductor post-processing
- RDL
- Passivation
- TSV
- TSV bottom hole
- Printed circuit board
