This mask aligner uses light source and optical technologies developed by Ushio over many years. This exposure device supports not only ihg rays, but the deep UV range as well.
Component Technology
Ð Includes the worldÕs number one super high-pressure UV lamp
Ð Our own irradiation optical system boasting a high degree of uniformity
Features & Benefits
- High resolution
The highest line-space resolution of 1 um (vacuum hard contact) is achieved. Proximity lithography achieves high line-space resolution of 3 um at 20 um gap. Line width stability is also excellent with high stage flatness and gap stability. We can propose the best optical system to achieve the optimal resolution for each lithography mode according to the material.
- Achieves high overlay accuracy
Overlay precision: achieves ±1 um during surface alignment, and ±1.5 um during back side alignment. High-precision registration accuracy is achieved by optimal alignment lighting and image processing software techniques to suit various substrates and alignment marks.
- MEMS
- Crystal oscillators
- SAW filters
- RF devices
- Sensors
- Inkjet heads
- Diodes
- IGBT
- Power semiconductors
- Thyristors
- MOS-FETs
- LEDs
- Power amps
- MMICs
- BAW filters
- Acceleration sensors
- Inductors
- Passive components
- Solar cells and more
